Monday, December 3, 2012

VIA not the only one investing in 3D printing

An online 3D printing service called 'Staples 3D Printing' will allow customers in Belgium, with more countries to follow, to upload their printing files toa website and order "prints". The Mcor Iris 3D printer will be responsible for the printing.

This new online service demonstrates the demand for 3D printing services, a new technology that VIA backed earlier in the year with a VIA Mini-ITX powered machine.

Thursday, November 22, 2012

VIA to manufacture 2 USB 3.0 controllers with easy Windows 8 built in support

The VIA Labs VL805 and VL806 USB 3.0 Host Controllers have been announced. Motherboards and PCI cards sporting these chips will automatically install in-box drivers in Windows 8, making installation a breeze.



"The next generation single chip VIA VL805 and VIA VL806 Host controllers include enhancements for improved performance, seamless cross compatibility and interoperability, and new features such as support for USB Battery Charging and “Charging Downstream Port” which enables both fast data sync and rapid charging with compatible devices. The VIA VL805 and VIA VL806 comply with the Universal Serial Bus 3.0 Specification for Super-Speed transfers and Intel's eXtensible Host Controller Interface (xHCI) 1.0 specification and add native inbox driver support for Windows 8. VIA VL805 and VL806 host controllers are USB-IF certified and are currently shipping." - Press Release.

Tuesday, November 13, 2012

Apple and HTC agree to share

After years of court cases and infringement hearings, Apple and HTC have agreed to let matters drop in exchange for a 10 year sharing of patents. Lawyers across the world fear the downturn in patent dispute cases! But seriously, the joint agreement will end all of the he did, she did and let the two get back to their core businesses.

This does of course mean that Apple have to just compete with HTC in the US rather than focus on trying to keep them out of that market on legal grounds.

"The two companies, which have been locked in a series of bitter patent disputes over the last two years, agreed to a 10-year joint licensing agreement for all current and future patents from both companies, according to a brief statement issued this evening. Financial terms of the settlement were not released." - CNet.

Tuesday, September 4, 2012

VIA Telecom Cracks into US Market


San Diego, CA, 3rd September, 2012 – VIA Telecom, Inc., the only alternative CDMA baseband solution provider, today announced that its CDMA 3G EV-DO Rev A baseband chip has been chosen to power the Coolpad Quattro 4G smartphone, available now through MetroPCS. This is the first smartphone entry in to US Market from Yulong Telecommunication, a professional provider of integrated solutions for smartphones, mobile data platform systems and value-added business operations in China.

The Coolpad Quattro 4G phone is designed to maximize the speed of the latest MetroPCS 4G network while relying on its existing 3G network through the VIA Telecom baseband chip when its 4G network is unavailable, thus providing seamless voice and data coverage for its customers who are always on the move. The Coolpad Quattro 4G also sports a 1GHz dedicated Cortex A8 CPU for fast Internet browsing and streaming media at blazing-fast 4G LTE speeds.

“Yulong Telecommunication and VIA Telecom have enjoyed a successful partnership in the China market and we are extremely happy to have the VIA Telecom CBP7.x CDMA EVDO platform help successfully launch their first Smartphone into the US Market,” said Dr. Ker Zhang, CEO of VIA Telecom, Inc. “This is yet another key milestone and validation for VIA Telecom who has also been supporting Tier-1 OEMs like Samsung to launch its 3G and 4G devices into Verizon Wireless, Sprint, US Cellular and other key US CDMA Carriers, bringing competition, cost benefits and technology choices to a market that is still mostly dominated by a single technology source.”

About VIA Telecom
VIA Telecom is a privately-held company that provides the only alternative CDMA 1xRTT and EV-DO Rev A baseband solution. Its solutions are being adopted by all key Global OEMs and commercially proven at all major CDMA networks around the globe. VIA offers cost competitive CDMA modem products and continues to provide choices in both 2G and 3G modem technologies. VIA also enables 4G modem providers to address CDMA markets that would normally be inaccessible to their 4G-only solution. http://www.via-telecom.com/

VIA Telecom Contacts

International:
Daniel Lee
Phone:
(01)-858-414-0415
Fax:
(01)-858-350-0171
Email:

Note to reporters, editors and writers: VIA is written in ALL CAPS.

The names of actual companies and products mentioned herein may be the trademarks of their respective owners.

Tuesday, August 14, 2012

WonderMedia promises cordless entertainment

It never ceases to amaze me how much WonderMedia fits into a chip. SoC designs features video, audio, storage, memory etc, and the WonderMedia PRIZM WM8950 SoC platform, it has just been announced, will support the upcoming Wi-Fi CERTIFIED Miracast™ standard. Miracast was developed by the Wi-Fi Alliance®. It's got nothing, pretty much, to do with networking; it's all about streaming audio and video with NO WIRES! The potential products that could be developed are fantastic. A lounge room PC hooked up to a media file server ... add in a snazzy remote control device and you've finally got the home entertainment system we've all been dreaming of.

"Miracast certified devices will be able to deliver audio and video content from one device to another through a Wi-Fi connection, eliminating the need for cables. These devices will be able to connect directly, without the need of a wireless access point, making it possible to watch videos from a tablet on a big screen television or share a smartphone screen with the conference room projector. Televisions, set-top boxes, notebooks, tablets and handsets are among the types of devices which will be certified."

[Press Release]

Sunday, August 12, 2012

Cher Wang talks about what it takes to be a tech success

Cher Wang, Chairwoman of HTC, married to VIA's CEO Wen-Chi Chen, spoke to Entrepreneur about her success and what made it possible ... an 'X' factor, the company culture, market forces? Cher's main answer is that it's a dedication to monitoring market demand and then providing what the customer wants.


Entrepreneur: When it comes to product development, how do you stay ahead of the curve? 

Wang: Keen observation. We must always keep an eye on our environment, to keep track of what changes are happening in technology, in infrastructure, in markets, in how people across the world are living their lives, working and communicating. We need to anticipate these trends and innovate to meet them. Within HTC, hundreds of ideas are tested and discarded to find those rare ideas that define the HTC user experience.

Thursday, August 9, 2012

VIA granted a patent about identifying redundant data ... or something

I am not going to pretend to fully understand this patent. Patent 8229001 concerns an invention of VIA Technology's Eric Huang, and a method to identify coded_block_flag parameter ... er, or something like that. Here is the official information:

"The idea of video compression is to omit certain data of an image that are imperceptible to human's eyes, i.e. so-called visual redundancy. The data to be omitted are generally similar to other data in space or time dimension, and thus can be removed according to a compression algorithm. H.264/AVC is one of the mainstream standards of video compression. Compared to conventional digital video compression standards, such as MPEG-2, MPEG-4 or H.263, H.264 exhibits higher compression performance, and nevertheless reaches better image quality under the same compression ratio.
"The coding mechanism of H.264/AVC compression is block-based. In brief, an image frame is divided into a plurality of rectangular areas called as macroblocks (MB). The macroblocks are then encoded. First, intra-frame prediction and inter-frame prediction techniques are used to remove the similarities between images so as to obtain the residual differences. Then the residual differences are spatially transformed and quantized to remove the visual redundancy.
"An important factor of the high compression efficiency in H.364/AVC is the utilization of context adaptive binary arithmetic coding (CABAC). Please refer to FIG. 1A, in which the operation of a CABAC decoder is briefly illustrated. For CABAC decoding, the decoder 10 executes a decoding operation for each block to generate a corresponding coded_block_flag parameter. The coded_block_flag parameter indicates whether a given block contains any non-zero residual difference or not. If there is no residual difference, the coded_block_flag parameter is set to '0' for the given block. Otherwise, the coded_block_flag parameter is set to '1' if there exists non-zero residual difference in the given block.
"The decoding operation of the decoder 10 is based on a context ID which includes a base portion and an offset portion. The base portion can be obtained by a lookup table, but the offset portion is calculated from the coded_block_flag. Therefore, a key point to calculate the coded_block_flag parameter is to obtain corresponding offset portion. For calculating the offset operation, the coded_block_flag parameters of neighboring left and top blocks next to the target block have to be determined in advance. For example, as illustrated in FIG. 1B, an image frame 11 encoded in H.264 is divided into a plurality of macroblocks 12, and each of the macroblock 12 is further divided into a plurality of blocks 13, e.g. M.times.N blocks K11.about.Kmn. For example, M=N=4 as illustrated in FIG. 1C shows the macroblock 12 is divided into 16 blocks labeled as 0.about.15 and each of the blocks 0.about.15 includes 4.times.4 pixels. The offset value of each block 13 is calculated according to coded_block_flag parameters of the neighboring left and top blocks of the current block.
"Due to the reason that characteristics of neighboring left or top blocks of each block may be different (e.g. size of each, inter or intra macroblock), H.264 utilizes a universal algorithm for calculating the offset value of all blocks. This would result in huge and complex computation since every block demands repeated processing. Consequently, hardware resource is occupied and causes large consumption of time. It can be realized that there exists a need to solve such deficiency."

Sunday, July 22, 2012

Ivy Bridge fails to kick VIA Labs out of USB 3.0 market

Intel's Ivy Bridge chip was released in April 2012 and was set to spell certain doom for third party USB 3.0 chips like those offered by VIA Labs.

VIA Labs and other Taiwanese design houses are, however, continuing to receive orders for their USB 3.0 chips for peripheral cards and products, a demand which sources say will continue until the second half of 2013. [Source]

Friday, July 13, 2012

The classy case-modder does it again

Jeffrey Stephenson, who has been designing and constructing beautiful wooden cases for VIA's embedded boards for close to ten years was, not surprisingly, provided with a pre-production sample of the $49 VIA APC. There is absolutely no doubting who designed this. Jeffrey has a recognisable classic '20s inspired sort of look and the other distinct visual is quality and luxury. Now this is a classy lounge room PC ...

Source

VIA Telecom gets assigned a patent

Patent 8,213,933 developed by a guy in San Diego concerns the communication of messages between a base station and a mobile device. I wonder what VIA Telecom are up to with this patent?


VIA's Mini-ITX power 3D printing machine

I have read a bit about 3D printing. It's fascinating tech and what's even more fascinating is how it could revolutionise the way we procure goods. Imagine being able to design objects by manipulating templates and then watching while it prints. I'm sure the watching part would get old pretty quick, but choosing and ordering items could well be revolutionised.

The idea that 3D printers could end up in every home is something that many bloggers have predicted. Small and quiet PCs are required to run the software for the printers. No doubt one day they'll all be combined into one device. VIA's embedded systems have features which make them very suitable to this sort of application.


TweakTown were given the chance to visit VIA's Taipei office and have their TT logo printed in 3D on a system with aVE-900 Mini-ITX powered MakerBot 3D printer. Here are the results.

Sunday, May 13, 2012

$44 will get you 7 USB 3.0 ports

A Japanese online retailer has just listed a 7 port USB 3.0 PCIe card that features the VIA Labs' VL810 chip. The card draws power from SATA but still wouldn't be able to provide full USB 3.0 speed to all 7 USB 3.0 ports at once. But if you have an older PC and you want to add USB 3.0 ports, this is a way to do it without having a powered USB hub sitting on your desk, external to your PC.


Thursday, May 10, 2012

VIA Labs USB 3.0 controller turns up on Orico PCIe card

I can't tell you which of VIA Labs' USB 3.0 chips is on Orico's new 7 port PCIe card, but it's one of them! Not much else is known except that it's a world's first.


[Source]

Wednesday, April 25, 2012

Cher Wang honoured as one of the most powerful women in tech

The tech industry has a reputation for being male-dominated, but there are at least ten women who wield a lot of power in the sector, including VIA's chairman, Cher Wang.

"Wang represents Taiwan on the APEC Business Advisory Council and HTC is an industry partner of the World Economic Forum. A devout Christian, she was ranked the 276th richest person in the world, with an estimated personal wealth of $4 billion, by Forbes Magazine, which describes her as “the most powerful woman in wireless.” “Her impetus for starting HTC was to develop hardware products that foster easier, more efficient communication. She’s led HTC in approaching development from the perspective of creating a holistic experience with a focus on personal choice, observing and listening to create products that cater to a perceived consumer desire,” says Leighton." - Source.

Sunday, April 22, 2012

VIA Labs new USB 3.0 controller with more power

The new VIA Labs VL812, a USB 3.0 hub controller, provides more power to connected devices meaning that more devices which require power from the hub can be connected at once.





"The VL812 as VLI’s new USB 3.0 hub is called consumes less than half a Watt during use and the company claims that this allows for an external USB 3.0 2.5-inch hard drive, a USB 2.0 flash drive and a USB mouse to be bus powered all at once from a USB 3.0 port."
- Read more

Sunday, April 15, 2012

VIA see opportunity with USB 3.0 peripherals

USB 3.0 has been around for a long while now, but it's still not found in every system. As more new computers are sold with USB 3.0, however, the market for USB 3.0 peripherals expands. VIA and other USB 3.0 controller manufacturers are gearing up for an increase in sales and as Digitimes reports:

"ASMedia Technology and VIA Labs reportedly have secured 2012 orders for USB 3.0 bridge controllers used in external HDDs from Toshiba and other Japan-based vendors, with shipments to kick off later in 2012. Both firms have primarily put their focus on products for USB 3.0-compatible peripherals."

Thursday, April 12, 2012

VIA becomes an Adopter Member of TCG

The Trusted Computing Group develops and maintains standards for security in computing and earlier this week VIA became an Adopter Member.

"More than 500 million PCs and other devices include a Trusted Platform Module. Almost all storage vendors now support TCG's Opal and enterprise specifications for self-encrypting drives, and TCG's Trusted Network Connect architecture is supported in hundreds of products from networking infrastructure companies. 


The Trusted Computing Group provides open standards that enable a safer computing environment across platforms and geographies." - Source.

Tuesday, April 10, 2012

VIA shows off Android running on their ARM processors


Google's Android operating system is most commonly found on smartphones. It's had less success on tablets, being lately eclipsed by the iPad, at least in Western countries. The operating system has the potential to be used on other types of devices though and VIA was demonstrating this at the DESIGNWEST 2012 conference. Engineering TV did a long and insightful interview with Cliff Moon from VIA about the topic.


Sunday, April 1, 2012

VIA processors partnered with new GE COM module

The VIA Nano and VIA Eden processors are being paired with a new COM module by General Electric Company, designed to make upgrades and maintenance cost effective for harsh environment scenarios.

"Taking advantage of GE’s extensive experience in developing rugged solutions for military applications, the bCOM6-L1200 is ideal for OEMs designing computing platforms into equipment for industrial or harsh environments to whom reducing the overall design cycle and lowering validation costs are of key importance."

"For systems integrators looking for solutions that deliver high performance coupled with low power consumption, the bCOM6-L1200 offers a range of five VIA Nano and VIA Eden processor options, with performance between 800MHz and 1.2GHz and power consumption between 3.5W and 13.0W. Up to 8GB of DDR3 SDRAM can be configured, allowing the most demanding applications to be deployed."

- Source.

Monday, March 26, 2012

VIA WonderMedia helps bust the sub-$80 tablet mark

In a country like India where the number of consumers is just mind-bogglingly huge and the number of people with income to spend on gadgets in only increasing, mass-producing a device and making money off volume sales with a low price-point is seeing previously unheard of price barriers busted open.

The new "Ira" tablet "features 7 inch resistive display, 800MHz VIA WonderMedia ARM SoC , Wi-Fi connectivity, 2GB internal memory, 512MB RAM, 3G modem support via USB, 3.5mm audio jack and a 2800 mAh battery. It is being sold at Rs 4,000."

Rs 4,000 is just $78 USD. I bought a tablet with a very similar spec about 18 months ago for $280. Incredible!

Monday, March 19, 2012

VIA Labs USB2Expressway featured in Digitimes

An exploratory article in Digitimes has exposed the smart idea behind VIA Labs' USB2Expressway technology. As the article explains, although the uptake of USB 3.0 in the consumer segment has been impressive, the embedded and industrial markets haven't made the switch quite so readily. The VIA Labs USB2Expressway targets the reasons behind this and offers a compelling solution.

"USB2Expressway applies VIA's USB 3.0 Enhanced HUB concept and unique, independently-developed U3TT chip technology to the "one to many" control model used in many industrial control sectors, providing ample bandwidth of 480Mbps to every USB 2.0 device connected downstream of the hub. USB 2.0 devices used to only be able to share the bandwidth provided by the USB 2.0, so even when no devices were using the USB 3.0 hub's bandwidth, the connections just sat idle. As Hsu explained, VIA's unique design means that USB 2.0 devices on its USB 3.0 Enhanced HUB can now use the up-to-5Gbps of USB 3.0 bandwidth. This makes it possible for every USB 2.0 device on the hub to access the full 480Mbps, markedly boosting device performance."

Sunday, March 18, 2012

VIA x86 processor shipments down

Shipments of VIA's x86 processors were down to 80 000 in the last quarter of 2011, according to figures released by IDC. Despite this, VIA is battling on, continuing to hold a strong market share in embedded systems using for thin clients and signage.

"Despite challenges, Via will continue to compete in the PC market, Rau said. One of Via's parent companies is Formosa Plastics Group, which has deep pockets and could provide a cash flow for Via to continue competing, Rau said. Via's future is embedded computing, in which the company has a notable market share, Rau said. In a typical quarter now, Via ships about 400,000 to 500,000 processors designed for embedded systems, such as thin clients and digital signs."

[Source].

Monday, March 5, 2012

VR-Zone takes a closer look at VIA's USB2Expressway

Intrigued by the VL811 hub that VIA debuted at CES back in January, VR-Zone have taken a closer look at how the technology works and what speed increases can be expected from USB 2.0 devices. Essentially this chip sits on a USB hub controller PCI card. If USB 2.0 devices are plugged in to this USB 3.0 hub the bandwidth gets shared and so although the USB 2.0 devices can't and won't operate at USB 3.0 speeds, they will operate at their maximum speed with no slowdowns. Read on for a full explanation.

Tuesday, February 28, 2012

It's like a Mini-ITX board on a single chip

... well not quite, but close to it! Right now at the Embedded World Exhibition, VIA is showing off the 
VIA COMe-8X90 module. At 95 x 125mm it's impressive to realise that it sports a 1.2GHz VIA Nano X2 E-Series dual core processor and a VIA VX900H media system processor (MSP).

"COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles."

VIA's COMe-8X90 comes with a SDK kit, BSPs, reference design ... all the kit that an OEM would need. Find out more in the Press Release.

Wednesday, February 22, 2012

WonderMedia chip gets WiDi thumbs up

The Intel WiDi technology allows PCs and laptops to connect wirelessly to large TV screens, potentially allowing for video files to be streamed to the lounge room. The WonderMedia PRIZM WM8720 SoC Platform has been certified for WiDi now.

"Intel WiDi allows people to wirelessly enjoy their laptop or desktop PC content on the biggest screen in their home through either an external wireless adapter or an embedded solution that is integrated into a TV or monitor, and a simple Intel based WiFi connection from their computer. Setup is a snap and Intel WiDi Widget allows people to share their screen with the simple push of a button." - Full PR.

Sneak preview of new VIA USB cable tech



TweakTown visited the VIA labs offices in Taipei and got a sneak peak at a new cable technology that VIA have been working on that gets rid of the security issues with long USB 3.0 cables. The new design uses fibre optic and can't be hacked into. Due to the cost of the technology, VIA is only targeting government and big business with the new cable at the moment.

"Besides the benefits of the added length and better security since fiber optic cabling does not omit EMI, USB 3.0 cable with fiber optics is far less lighter than copper based cabling and it is also much thinner, possibly allowing it to get into really tight areas where traditional and thicker USB 3.0 cable may not fit."

Thursday, February 16, 2012

VIA Making a SoC with SSD Support

VIA will be making a System on Chip (SoC) that includes supports for Solid State Drives (SSDs). The news come as Tensilica announces VIA's choice to use their DPU for the task.



"Tensilica's DPUs allow designers to customize the IP core, mix both control and signal processing, and add high-bandwidth connectivity to increase performance without increasing the clock speed. For example, designers can use single-cycle bit field manipulation and arithmetic instructions along with multiple simultaneous single-cycle table lookups to achieve over 10 times the efficiency of other processors. This not only increases IOPS, but also significantly reduces the energy consumed and the complexity of the SOC design itself." [Source]

Although not much else about this development has been announced, I wonder whether it's VIA who will be producing this SoC or VIA Wondermedia, a favorite SoC solution of many tablets found in South East Asia.

Wednesday, February 8, 2012

VIA Telecom chip gives Samsung more power and less cost

The Samsung Galaxy Nexus will soon run on a Via Telecom CDMA/EV-DO Rev chip combined with a Samsung LTE chip, which together cost less than half of the $23 that the previous LTE chip Samsung used used to cost. Technology is getting faster and more advanced but also cheaper.




"Emerging markets and the spread of LTE technology have also contributed to the growth of the smartphone market, which is expected to grow by more than 30 percent. The telecommunication system business will further solidify its leadership in the wireless network market with the expansion of the LTE service in Korea and North America." Source: Telecomlead.com

Tuesday, February 7, 2012

Mini-ITX in print ... well digital print

"VIA Technologies developed the Mini-ITX format 10 years ago and it quickly became the preferred platform for modders the world over. In celebration of the 10 year anniversary of the launch of the platform, VIA has self-published an e-book titled ”Small is Beautiful: 10 Years of Mini-ITX” detailing the development of the platform and highlighting some of the best Mini-ITX mods of the last 10 years. Flipping through the virtual pages was a trip down memory lane."


Download the Mini-ITX eBook



It bet it was! This is the intro to a write up in UK HTPC about VIA's recent eBook. Any blogger who has followed HTPC developments over the last ten years would be very familiar with the Mini-ITX.

Anyone can get a free copy of the eBook here.

Thursday, February 2, 2012

Some VIA Labs News I missed From CES

On show at CES last month was a device that I missed hearing about. "Collaboratively created with FOCI, PCL, OpTarget and UMEC, the VIA Labs V0510 visual transceiver extends the attain of USB 3.0 to over 100 meters."

The reason why this probably escaped my attention is because its application is actually fairly obscure:

“The UMEC Thumb ONE USB 3.0 AOC can expand gigabit-speed USB 3.0 transmission stretch up to 100m (330ft) with visual fibers. Since visual fibers bring light instead of electric impulses, they are rarely resistant to electromagnetic interference and they do not illuminate any of their own, creation the USB 3.0 AOC an glorious answer for applications in Medical Imaging Equipment, Broadcast TV, and others where high-tolerance to interference is desirable” mentioned K.T. Chao, Vice President of UMEC."

Source: Audiovideoton.com

Wednesday, February 1, 2012

VIA Telecom: The Quiet Achiever

VIA Telecom had a good year in 2011, with profits up 60% and sales of 10 million entry level CDMA chips and another 8 million for other better known manufacturers. Having also sold LTE chips to Samsung and Motorolla, Digitimes notes that "VIA Telecom aims to land comparable solution orders from affiliate company HTC in 2012". 

Tuesday, January 24, 2012

VIA chips still doing well in whitebox tablet sales

I don't hear a lot about no-brand tablets anymore; one upon a time there was just about daily news on the topic. According to this article though, they are still big in China and other Asian countries. In fact the article suggests that 44% of tablet sales feature VIA 8650 chips. Who knows if this is true?

Thursday, January 19, 2012

WonderMedia tablet chips support Android 4.0

WonderMedia made some of the first chips to support Android tablets and they have just announced a new one that supports the latest Android 4.0. The WonderMedia PRIZM WM8950 SoC supports 1080p video playback, Windows CE 7.0 and Android 4.0.

The chip is destined for more than just tablets:

"With its high-performance, and feature-rich design, the WM8950 is also optimized for a wide range of innovative system design applications, including smartbooks, Smart TV, SmartStream for wireless display and multimedia streaming, networked projectors, digital signage, and thin clients." - Source.

Monday, January 16, 2012

New USB Tech from VIA Labs Boosts USB 2.0

USBExpressway, quite a mouthful, is a new technology by VIA Labs which means that when you've got multiple USB 2.0 devices plugged into a USB 3.0 hub, they will operate at full potential speed. This is realized by each device having their own port rather than sharing bandwidth.

"USB 2.0 provides 30-40MB/s of actual throughput, and this is shared across all connected devices. When multiple devices such as external hard drives, flash drives, and webcams are connected, they share available bandwidth which results in severely degraded performance. Compared to USB 2.0, USB 3.0 offers 10x more bandwidth and allows transfers as fast as 300-400MB/s. VIA Labs USB2 Expressway Dedicated Bandwidth Technology allows USB 2.0 devices to utilize USB 3.0 bandwidth, eliminating bandwidth bottlenecks and freeing each connected device to reach its maximum performance potential." - Source.

Monday, January 9, 2012

VIA's WonderMedia Making a Splash at CES

WonderMedia, a subsidiary of VIA, has a SoC solution, the WM8720, which features the Intel WiDi solution. With this technology you can stream content from a PC or laptop to any screen equipped with the WiDi connection. This can be provided via a chip in the TV or monitor, or an add-on. A total of six companies will be featuring the Intel WiDi solution with the WonderMedia WM870 chip at the Consumer Electronics Show in las Vegas this week. - Source.

Sunday, January 8, 2012

VIA Nano Processor Powers New Lenovo Set Top Box

BesTV New Media and Lenovo launched a new Internet Set Top box in Shanghai last week. Lenovo is a huge brand in China and BesTV apparently handle distribution of 90% of the country's box office content. A third partner is VIA who will be providing the processor and media chip to power the new A30 wonder.

"Further hardware details are scarce at this point, but we do know that the A30 will have a BesTV service providing new and exclusive content, including movies of unknown origin "within a month of their release date," along with picture-in-picture functionality and, of course, internet access. There's mobile functionality too, as your smartphone can serve as both the box's remote and as an additional screen on which to view content. Naturally, Lenovo's not telling how much it'll cost, but our friends in the Far East will be able to pick one up in Q1 of 2012." - Engadget